VI BRICK™ BCM  Thermally Enhanced
Input Voltages: 38 – 55 Vdc, 330 – 365 Vdc, 360 – 400 Vdc
Output Voltages: 1.19 – 55.0 Vdc
Output Power
(per module):
135 – 300 W
Efficiency: Up to 96.4%
Dimensions:
Flanged baseplate
(Height above board)

1.91" x 1.09" x 0.37" (48,6 x 27,7 x 9,5 mm)
Features:
  • High Power density up to 390 W/in3
  • Fast transient response: < 1 µS
  • Small footprint: 2.08 in2
  • Low profile: 0.37 inches above board
  • 100°C baseplate operation
  • RoHS compliant — compatible with lead free wave soldering processes
  • Agency approvals

Vicor's VI BRICK BCM Bus Converters are ideal for Integrated Bus Architecture applications requiring simplified thermal management approaches. The modules incorporate V•I Chip™ technology to provide a highly reliable design in addition to superior power density and efficiency. These products provide a rugged design and simplified mounting to reduce design time and thermal management costs.

 

 

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