Every MI Family module undergoes extensive post-production environmental stress screening (ESS) before shipment to verify compliance with Vicor's high quality and performance standards and to eliminate early life failures. The current program of unpowered temperature cycling and dynamic power cycling burn-in is the result of years of test data analysis, process improvement, and screening strength calculations based on DOD-HDBK-344A, Hughes Model RADC-TR-86-149, and IES ESSEH Guidelines. To ensure the most effective routine for precipitating module failures, Vicor continually evaluates its ESS program and makes appropriate changes as new data become available or as product improvements occur. After burn-in and temperature cycling, each module undergoes final electrical testing over the specified temperature range. The program is outlined below.
Because operating temperature is one of the most important factors in determining overall module reliability, it is imperative that the user's system design allow for efficient heat transfer from the baseplate to system ambient. Since temperature and failure rate are exponentially related, just a 10°C decrease in baseplate temperature can have a dramatic increase in MTBF. Due to patented zero-voltage/zero-current switching topology, Vicor converters are highly efficient compared to those with more traditional topologies. High efficiency translates into both smaller size and lower temperature rises. To minimize thermal impedance, all major power dissipating components are mounted directly to the baseplate. Below are representative calculated MTBF values based on MIL-HDBK-217F. If you require information about a specific model, contact Vicor with the model number, expected baseplate temperature, and operating environment to obtain an individually prepared report.
Fully encapsulated, Vicor's MI Family modules utilize a proprietary spin fill process that assures complete, void free encapsulation making them suitable for the most harsh environments. In addition to providing mechanical rigidity, the encapsulant is thermally conductive to eliminate hot spots and aid in heat transfer to the baseplate. Two grades, I & M, are available with temperatures to -55°C operating and -65°C storage. To verify the suitability of Vicor's MI Family products for harsh environments, MI Family modules have been subjected to the environmental testing requirements of MIL-STD-810 and MIL-STD-202. These tests, listed below, are performed at an independent laboratory. Additional environmental tests can be done upon individual customer request. Some of those performed for specific customer applications include ESD (DOD-HDBK-263), Structure Borne (Acoustic) Noise, Transportation Vibration, Flammability, Terminal Strength, Thermal Shock, and Power Conditioning. Contact the factory for details. Altitude
Explosive Atmosphere
MIL-STD-810C, Method 511.1, Proc I.
Vibration
Shock
Acceleration
MIL-STD-810D, Method 513.3, Proc. II operational test, 9 G's for 1 minute along 3 mutually perpendicular axes.
Humidity
MIL-STD-810D, Method 507.2, Proc I, Cycle I, 240 hrs, 88% relative humidity.
Solder Test
MIL-STD-202, Method 208, 8 hr. aging.
Fungus
MIL-STD-810C, Method 508.
Salt Atmosphere
MIL-STD-810C, Method 509.1.
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